Antenna device and electronic device including same

ABSTRACT

Various embodiments provide an antenna device that includes: a metal member configured to have a length that contributes to at least a part of an electronic device; a printed circuit board (PCB) configured to be feed-connected to a preset position of the metal member in order to apply the metal member as an antenna radiator; and at least one electronic component electrically connected to a position different from the feeding position of the metal member and grounded to the PCB, and provide an electronic device that includes the same. Accordingly, the antenna device is grounded to the PCB in a desired position of the metal member by using the basically provided electronic component so that it is possible to exclude a separate electrical connection member, thereby reducing the cost, increasing the use of space, enhancing the degree of freedom of the design of the antenna radiator.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of application Ser. No. 16/284,966,filed Feb. 25, 2019, which is a continuation of application Ser. No.15/222,899, filed Jul. 28, 2016, now U.S. Pat. No. 10,218,396, whichclaims priority to Korean Application No. 10-2015-0106687, filed, Jul.28, 2015, the entire contents of which are hereby incorporated byreference.

BACKGROUND 1. Field

Various embodiments of the present disclosure relate to an electronicdevice, and for example, to an electronic device that includes anantenna device.

2. Description of Related Art

Electronic devices have become slimmer in order to meet consumers' needsas the functional gap therebetween has significantly decreased.Electronic device makers have made efforts to make electronic devicesslim while increasing the rigidity thereof and improving the design.Reflecting this trend, the electronic devices have been developed toefficiently ensure an arrangement space of at least one antenna devicethat is necessarily required for communication among elements thereof inorder to prevent degradation in radiation performance and to achieve anexcellent performance.

Antenna devices used in electronic devices have an inverted-F antenna(IFA) or a monopole radiator as a basic structure, and a volume and/or anumber of antenna radiators to be mounted may be determined according tofrequency, bandwidth, and a type of each service. For example, althoughthere is a difference in frequency between areas in the world, a lowband of 700 megahertz (MHz) to 900 MHz, a mid-band of 1700 MHz to 2100MHz, a high band of 2300 MHz to 2700 MHz, and the like are generallyused as major communication bands. Additionally, various wirelesscommunication services are used, such as Bluetooth (BT), globalpositioning system (GPS), WIFI, etc. However, it is difficult to ensureall the bands with only a single antenna in reality. Accordingly, inorder to overcome the problems, multiple antennas are separatelydesigned by collecting service bands (e.g., similar frequency bands) tosatisfy all the aforementioned communication bands in a limited antennavolume of a given communication device.

For example, an antenna that performs voice/data communication (e.g.,general packet radio service (GPRS), wideband code division multipleaccess (WCDMA), long term evolution (LTE), etc.)), which is the majorcommunication system of a terminal device, may be located on a lower endportion of the terminal device where a small number of metal componentsthat deteriorate the performance of the antenna are mounted. Based onthe European standard, a total of 24 bands, including 2G (global systemfor mobile system (GSM)850, extended GSM(EGSM), digital communicationsystem (DCS), and personal communication system (PCS)), WCDMA (B1, B2,B5, and B8), LTE (B1, B2, B3, B4, B5, B7, B8, B12, B17, B18, B19, B20,B26, B38, B39, B40, and B41), etc., have to be implemented. In fact,since it is difficult to satisfy service provider specifications and thespecific absorption rate (SAR) standard and to minimize effects on humanbodies while implementing all the bands with a single antenna, antennasmay be implemented by collecting service bands having similar frequencybands over at least two areas. By way of example, 2G (GSM850, EGSM, DCS,and PCS), WCDMA (B1, B2, B5, and B8), and LTE (B1, B2, B3, B4, B5, B8,B12, B17, B18, B19, B20, B26, and B39) may be implemented with oneantenna, and LTE (B7, B38, B40, and B41) may be implemented with anotherantenna.

Further, in a case where an exterior of an electronic device isconstituted by a metal member (e.g., a metal bezel, etc.) in order tomeet a recent trend, an antenna may not be separately designed, asopposed to a dielectric injection-molded material, and may be designedby making use of the metal member as an antenna radiator.

For example, in a case where a metal member arranged on the outerperiphery of an electronic device is used as an antenna radiator,specific locations of the metal member are cut off by dielectric cut-offportions in order to adjust a physical length from a feeding part to theantenna, thereby enabling the antenna to operate in a desired frequencyband.

In this case, a ground part has to be disposed in a correspondingposition of the metal member in order to enable the metal member tooperate in the desired frequency band, but there is a difficulty in thata mounting space has to be provided in order to add a separateelectrical connection member (e.g., a C-clip, a conductive gasket, etc.)for a physical contact between the outer periphery of the metal memberand the ground part of a printed circuit board (PCB).

SUMMARY

To address the above-discussed deficiencies, it is a primary object toprovide an antenna device and an electronic device that includes thesame.

Various embodiments may provide an antenna device that includes: a metalmember configured to have a length that contributes to at least a partof an electronic device; a printed circuit board (PCB) configured to befeed-connected to a preset position of the metal member in order toapply the metal member as an antenna radiator; and at least oneelectronic component electrically connected to a position different fromthe feeding position of the metal member and grounded to the PCB, andmay provide an electronic device that includes the same.

Various embodiments may provide an antenna device that includes: a metalmember configured to have a length that contributes to at least a partof an electronic device; a printed circuit board (PCB) configured to befeed-connected to a preset position of the metal member in order toapply the metal member as an antenna radiator; and a side key assemblyelectrically connected to a position different from the feeding positionof the metal member and grounded to the PCB, and may provide anelectronic device that includes the same.

Before undertaking the DETAILED DESCRIPTION below, it may beadvantageous to set forth definitions of certain words and phrases usedthroughout this patent document: the terms “include” and “comprise,” aswell as derivatives thereof, mean inclusion without limitation; the term“or,” is inclusive, meaning and/or; the phrases “associated with” and“associated therewith,” as well as derivatives thereof, may mean toinclude, be included within, interconnect with, contain, be containedwithin, connect to or with, couple to or with, be communicable with,cooperate with, interleave, juxtapose, be proximate to, be bound to orwith, have, have a property of, or the like; and the term “controller”means any device, system or part thereof that controls at least oneoperation, such a device may be implemented in hardware, firmware orsoftware, or some combination of at least two of the same. It should benoted that the functionality associated with any particular controllermay be centralized or distributed, whether locally or remotely.Definitions for certain words and phrases are provided throughout thispatent document, those of ordinary skill in the art should understandthat in many, if not most instances, such definitions apply to prior, aswell as future uses of such defined words and phrases.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present disclosure and itsadvantages, reference is now made to the following description taken inconjunction with the accompanying drawings, in which like referencenumerals represent like parts: The above and other aspects, features,and advantages of the present disclosure will be more apparent from thefollowing detailed description taken in conjunction with theaccompanying drawings, in which:

FIG. 1 illustrates a network environment including an electronic deviceaccording to various embodiments of the present disclosure;

FIG. 2 illustrates a block diagram of an electronic device according tovarious embodiments of the present disclosure;

FIG. 3 illustrates a perspective view of an electronic device accordingto various embodiments of the present disclosure;

FIG. 4A illustrates a configuration of an antenna device according tovarious embodiments of the present disclosure;

FIG. 4B illustrates a configuration of a printed circuit board (PCB)according to various embodiments of the present disclosure;

FIG. 5A illustrates a radiation flow of an antenna device according tovarious embodiments of the present disclosure;

FIGS. 5B and 5C illustrate equivalent circuit diagrams of anelectric-shock prevention circuit and a matching circuit according tovarious embodiments of the present disclosure;

FIGS. 6A to 6C illustrate graphs of a voltage standing wave ratio (VSWR)by an antenna device that operates in individual operating bandsaccording to various embodiments of the present disclosure;

FIG. 7 illustrates a configuration of an antenna device according tovarious embodiments of the present disclosure;

FIG. 8 illustrates a configuration of an antenna device according tovarious embodiments of the present disclosure;

FIG. 9 illustrates a configuration of an antenna device according tovarious embodiments of the present disclosure;

FIG. 10 illustrates an exploded perspective view of a side key assemblyaccording to various embodiments of the present disclosure;

FIG. 11 illustrates a sectional view of major parts of a state in whicha side key assembly according to various embodiments of the presentdisclosure;

FIGS. 12A and 12B illustrate diagrams of a change in a ground positionby a side key assembly according to various embodiments of the presentdisclosure; and

FIGS. 13A to 13C illustrate graphs of a VSWR by an antenna device thatoperates in individual operating bands according to various embodimentsof the present disclosure.

DETAILED DESCRIPTION

FIGS. 1 through 13C, discussed below, and the various embodiments usedto describe the principles of the present disclosure in this patentdocument are by way of illustration only and should not be construed inany way to limit the scope of the disclosure. Those skilled in the artwill understand that the principles of the present disclosure may beimplemented in any suitably arranged electronic device. The followingdescription with reference to the accompanying drawings is provided toassist in a comprehensive understanding of certain embodiments of thepresent disclosure as defined by the claims and their equivalents. Itincludes specific details to assist in that understanding but these areto be regarded merely as examples. Accordingly, those of ordinary skillin the art will recognize that various changes and modifications of thevarious embodiments described herein can be made without departing fromthe scope and spirit of the present disclosure. In addition,descriptions of well-known functions and constructions may be omittedfor clarity and conciseness.

The terms and words used in the following description and claims are notlimited to their dictionary meanings, but, are merely used to enable aclear and consistent understanding of the present disclosure.Accordingly, it should be apparent to those skilled in the art that thefollowing description of various embodiments of the present disclosureis provided for illustrative purposes only and not for the purpose oflimiting the present disclosure as defined by the appended claims andtheir equivalents.

It is to be understood that the singular forms “a,” “an,” and “the”include plural references unless the context clearly dictates otherwise.Thus, for example, reference to “a component surface” includes referenceto one or more of such surfaces.

By the term “substantially” it is meant that the recited characteristic,parameter, or value need not be achieved exactly, but that deviations orvariations, including for example, tolerances, measurement error,measurement accuracy limitations and other factors known to those ofskill in the art, may occur in amounts that do not preclude the effectthe characteristic was intended to provide.

The terms “include” and “may include” used herein are intended toindicate the presence of a corresponding function, operation, orconstitutional element disclosed herein, and are not intended to limitthe presence of one or more functions, operations, or constitutionalelements. In addition, the terms “include” and “have” are intended toindicate that characteristics, numbers, operations, constitutionalelements, and elements disclosed in the specification or combinationsthereof exist. However, additional possibilities of one or more othercharacteristics, numbers, operations, constitutional elements, elementsor combinations thereof may exist.

As used herein, the expression “or” includes any and all combinations ofwords enumerated together. For example, “A or B” may include either A orB, or may include both A and

B.

Although expressions used in various embodiments of the presentdisclosure, such as “1st”, “2nd”, “first”, “second” may be used toexpress various constituent elements of the various embodiments of thepresent disclosure, these expressions are not intended to limit thecorresponding constituent elements. For example, the above expressionsare not intended to limit an order or an importance of the correspondingconstituent elements. The above expressions may be used to distinguishone constituent element from another constituent element. For example, afirst user device and the second user device are both user devices, andindicate different user devices. For example, a first constituentelement may be referred to as a second constituent element, andsimilarly, the second constituent element may be referred to as thefirst constituent element without departing from the scope of thepresent disclosure.

When an element is mentioned as being “connected” to or “accessing”another element, this may mean that it is directly connected to oraccessing the other element, or there may be intervening elementspresent between the two elements. On the other hand, when an element ismentioned as being “directly connected” to or “directly accessing”another element, it is to be understood that there are no interveningelements present.

The term “module” as used herein may imply a unit including one ofhardware, software, and firmware, or a combination thereof. The term“module” may be interchangeably used with terms, such as unit, logic,logical block, component, circuit, and the like. A module as describedherein may be a minimum unit of an integrally constituted component ormay be a part thereof. The module may be a minimum unit for performingone or more functions or may be a part thereof. The module may bemechanically or electrically implemented. For example, the module asdescribed herein includes at least one of an application-specific IC(ASIC) chip, a field-programmable gate arrays (FPGAs), or aprogrammable-logic device, which are known or will be developed andwhich perform certain operations.

By the term “substantially” it is meant that the recited characteristic,parameter, or value need not be achieved exactly, but that deviations orvariations, including, but not limited to, for example, tolerances,measurement errors, measurement accuracy limitations and other factorsknown to persons of ordinary skill in the art, may occur in amounts thatdo not preclude the effect the characteristic was intended to provide.

Unless otherwise defined, all terms, including technical and scientificterms, used herein have the same meaning as commonly understood by thoseof ordinary skill in the art to which various embodiments of the presentdisclosure belong. It will be further understood that terms, such asthose defined in commonly used dictionaries, should be interpreted ashaving meanings that are consistent with their meaning in the context ofthe relevant art and the various embodiments of the present disclosure,and should not be interpreted in an idealized or overly formal senseunless expressly so defined herein.

An electronic device as used herein may be a device including, but notlimited to, an antenna capable of performing a communication function inat least one frequency band. For example, the electronic device may be asmart phone, a tablet personal computer (PC), a mobile phone, a videophone, an e-book reader, a desktop PC, a laptop PC, a netbook computer,a personal digital assistant (PDA), a portable multimedia player (PMP),a moving picture experts group phase 1 or phase 2 (MPEG-1 or MPEG-2)audio layer 3 (MP3) player, a mobile medical device, a camera, and awearable device (e.g., a head-mounted-device (HIVID), such as electronicglasses, electronic clothes, an electronic bracelet, an electronicnecklace, an electronic appcessory, an electronic tattoo, a smart watch,and the like).

The electronic device may be a smart home appliance having an antenna.For example, the smart home appliance may include at least one of atelevision (TV), a digital versatile disc (DVD) player, an audio player,a refrigerator, an air conditioner, a cleaner, an oven, a microwaveoven, a washing machine, an air purifier, a set-top box, a TV box (e.g.,Samsung HomeSync®, Apple TV®, or Google TV®), a game console, anelectronic dictionary, an electronic key, a camcorder, or an electronicpicture frame.

The electronic device including the antenna may be one of variousmedical devices (e.g., magnetic resonance angiography (MRA), magneticresonance imaging (MRI), computed tomography (CT), imaging equipment, anultrasonic instrument, and the like), a navigation device, a globalpositioning system (GPS) receiver, an event data recorder (EDR), aflight data recorder (FDR), a car infotainment device, electronicequipment for a ship (e.g., a vessel navigation device, a gyro compass,and the like), avionics, a security device, a car head unit, anindustrial or domestic robot, an automatic teller machine (ATM), a pointof sales (POS) device, and the like.

The electronic device may be part of at least one of an item offurniture or a building/structure including an antenna. The electronicdevice may be an electronic board, an electronic signature input device,a projector, or any of various measurement machines (e.g., water supply,electricity, gas, a propagation measurement machine, and the like).

The electronic device may be one or more combinations of theaforementioned various devices. In addition, the electronic device maybe a flexible device. Moreover, the electronic device is not limited tothe aforementioned devices.

Hereinafter, an electronic device according to various embodiments willbe described with reference to the accompanying drawings. The term‘user’ used in the various embodiments may refer to a person who usesthe electronic device or a device which uses the electronic device(e.g., an artificial intelligence (AI) electronic device).

FIG. 1 illustrates a diagram of a network environment including anelectronic device according to an embodiment of the present disclosure.

Referring to FIG. 1, the electronic device 100 includes a bus 110, aprocessor 120, a memory 130, an input/output interface 150, a display160, and a communication interface 170. In various embodiments of thepresent disclosure, the electronic device 100 can omit at least one ofthe components or further include another component.

The bus 110 includes a circuit for connecting the components (e.g., theprocessor 120, the memory 130, the input/output interface 150, thedisplay 160, and the communication interface 170) and deliveringcommunications (e.g., a control message) therebetween.

The processor 120 includes one or more of a central processing unit(CPU), an application processor (AP), and a communication processor(CP). The processor 120 processes an operation or data on control ofand/or communication with another component of the electronic device100.

The processor 120, which may be connected to the LTE network, determineswhether a call is connected over a communication network, such as a CSservice network using caller identification information (e.g., a callerphone number) of the CS service network (e.g., the 2G/3G network). Forexample, the processor 120 receives incoming call information (e.g., aCS notification message or a paging request message) of the CS servicenetwork over the LTE network (e.g., CSFB). For example, the processor120 being connected to the LTE network receives incoming callinformation (e.g., a paging request message) over the CS service network(e.g., SRLTE).

When receiving the incoming call information (e.g., a CS notificationmessage or a paging request message) of the CS service network over theLTE network, the processor 120 obtains caller identification informationfrom the incoming call information. The processor 120 displays thecaller identification information on its display 160. The processor 120determines whether to connect the call based on input informationcorresponding to the caller identification information displayed on thedisplay 160. For example, when detecting input information correspondingto an incoming call rejection, through the input/output interface 150,the processor 120 restricts the voice call connection and maintains theLTE network connection. For example, when detecting input informationcorresponding to an incoming call acceptance, through the input/outputinterface 150, the processor 120 connects the voice call by connectingto the CS service network.

When receiving the incoming call information (e.g., a CS notificationmessage or a paging request message) of the CS service network over theLTE network, the processor 120 obtains caller identification informationfrom the incoming call information. The processor 120 determines whetherto connect the call by comparing the caller identification informationwith a reception control list. For example, when the calleridentification information is included in a first reception control list(e.g., a blacklist), the processor 120 restricts the voice callconnection and maintains the connection to the LTE network. For example,when the caller identification information is not included in the firstreception control list (e.g., the blacklist), the processor 120 connectsthe voice call by connecting to the CS service network. For example,when the caller identification information is included in a secondreception control list (e.g., a white list), the processor 120 connectsthe voice call by connecting to the CS service network.

When receiving the incoming call information (e.g., a paging requestmessage) of the CS service network over the LTE network, the processor120 sends an incoming call response message (e.g., a paging responsemessage) to the CS service network. The processor 120 suspends the LTEservice and receives the caller identification information (e.g., acircuit-switched call (CC) setup message) from the CS service network.The processor 120 determines whether to connect the call by comparingthe caller identification information with the reception control list.For example, when the caller identification information is included inthe first reception control list (e.g., the blacklist), the processor120 restricts the voice call connection and resumes the LTE networkconnection. For example, when the caller identification information isnot included in the first reception control list (e.g., the blacklist),the processor 120 connects the voice call by connecting to the CSservice network. For example, when the caller identification informationis included in the second reception control list (e.g., the white list),the processor 120 connects the voice call by connecting to the CSservice network.

The memory 130 can include volatile and/or nonvolatile memory. Forexample, the memory 130 may be a hard drive, flash storage, or RAM. Thememory 130 stores commands or data (e.g., the reception control list)relating to at least another component of the electronic device 100. Thememory 130 may store software and/or a program 140. The program 140 mayinclude, for example, a kernel 141, middleware 143, an applicationprogramming interface (API) 145, and/or application programs (or“applications”) 147. At least some of the kernel 141, the middleware143, and the API 145 may be referred to as an operating system (OS).

The kernel 141 controls or manages system resources (e.g., the bus 110,the processor 120, or the memory 130) used for performing an operationor function implemented by the other programs (e.g., the middleware 143,the API 145, or the applications 147). Furthermore, the kernel 141provides an interface through which the middleware 143, the API 145, orthe applications 147 connects the individual elements of the electronicdevice 100 to control or manage the system resources.

The middleware 143 functions as an intermediary for allowing the API 145or the applications 147 to communicate with the kernel 141 to exchangedata.

In addition, the middleware 143 processes one or more task requestsreceived from the applications 147 according to priorities thereof. Forexample, the middleware 143 assigns priorities for using the systemresources (e.g., the bus 110, the processor 120, the memory 130, etc.)of the electronic device 100, to at least one of the applications 147.For example, the middleware 143 may perform scheduling or load balancingon the one or more task requests by processing the one or more taskrequests according to the priorities assigned thereto.

The API 145 is an interface through which the applications 147 controlfunctions provided from the kernel 141 or the middleware 143, and mayinclude at least one interface or function (e.g., an instruction) forfile control, window control, image processing, text control, etc.

The input/output interface 150 functions as an interface that transfersinstructions or data input from a user or another external device to theother element(s) of the electronic device 100. Furthermore, theinput/output interface 150 outputs the instructions or data receivedfrom the other element(s) of the electronic device 100 to the user or anexternal electronic device.

The display 160 may include a liquid crystal display (LCD), a lightemitting diode (LED) display, an organic LED (OLED) display, a microelectro mechanical system (MEMS) display, an electronic paper display,etc. The display 160 displays various types of content (e.g., a text,images, videos, icons, symbols, etc.) for the user. The display 160 mayinclude a touch screen and receive, for example, a touch, a gesture,proximity, a hovering input, etc., using an electronic pen or the user'sbody part. The display 160 may display a web page.

The communication interface 170 can establish a communication betweenthe electronic device 100 and an external electronic device (e.g., afirst external electronic device 102, a second external electronicdevice 104, or a server 106). For example, the communication interface170 can communicate with the first external electronic device 102, thesecond external electronic device 104, or the server 106 in connectionto the network 162 through wireless communication or wiredcommunication. For example, the wireless communication can conform to acellular communication protocol including at least one of LTE,LTE-Advanced (LTE-A), CDMA, WCDMA, universal mobile telecommunicationsystem (UMTS), WiBro, or GSM.

The wired communication can include at least one of universal serial bus(USB), high definition multimedia interface (HDMI), recommended standard232 (RS-232), or plain old telephone service (POTS).

The network 162 can include at least one of telecommunications networks,for example, a computer network (e.g., Local Area Network (LAN) or WideArea Network (WAN)), Internet, and a telephone network.

The electronic device 100 provides the LTE service in the single radioenvironment by use of at least one module functionally or physicallyseparated from the processor 120.Various embodiments of the presentdisclosure will be described with reference to a display that includes abent or curved area and is applied to a housing of an electronic device,in which a non-metal member and a metal member (e.g., a metal bezel) areformed through dual injection molding, but are not limited thereto. Forexample, the display may be applied to a housing, in which a metalmember or a non-metal member is formed of a single material.

Each of the first and second external electronic devices 102 and 104 maybe a type of device that is the same as or different from the electronicdevice 101. According to one embodiment, the server 106 may include agroup of one or more servers. According to various embodiments, all orsome of the operations to be executed by the electronic device 101 maybe executed by another electronic device or a plurality of otherelectronic devices (e.g., the electronic devices 102 and 104 or theserver 106). According to one embodiment, in the case where theelectronic device 101 performs a certain function or serviceautomatically or by request, the electronic device 101 may request somefunctions that are associated therewith from the other electronicdevices (e.g., the electronic devices 102 and 104 or the server 106)instead of or in addition to executing the function or service byitself. The other electronic devices (e.g., the electronic devices 102and 104 or the server 106) may execute the requested functions oradditional functions, and may transmit the results to the electronicdevice 101. The electronic device 101 may provide the requestedfunctions or services by processing the received results as therequested functions or services are or additionally. For this purpose,for example, a cloud computing technique, a distributed computingtechnique, or a client-server computing technique may be used.

Various embodiments of the present disclosure will be described withreference to a display that includes a bent or curved area and isapplied to a housing of an electronic device, in which a non-metalmember and a metal member (e.g., a metal bezel) are formed through dualinjection molding, but are not limited thereto. For example, the displaymay be applied to a housing, in which a metal member or a non-metalmember is formed of a single material.

FIG. 2 illustrates a diagram of a configuration of an electronic device201 according to an embodiment of the present disclosure.

Referring to FIG. 2, a configuration of the electronic device 201 isprovided. The electronic device 201 may include all or some of thecomponents described with reference to the electronic device 101 ofFIG. 1. The electronic device 201 includes at least one applicationprocessor (AP) 210, a communication module 220, a subscriberidentification module (SIM) card 224, a memory 230, a sensor modu1e 240,an input device 250, a display 260, an interface 270, an audio modu1e280, a camera modu1e 291, a power management modu1e 295, a battery 296,an indicator 297, and a motor 298.

The AP 210 controls a plurality of hardware or software elementsconnected to the AP 210 by driving an operating system (OS) or anapplication program. The AP 210 processes a variety of data, includingmultimedia data, and performs arithmetic operations. The AP 210 may beimplemented, for example, with a system on chip (SoC). The AP 210 mayfurther include a graphical processing unit (GPU) or otherco-processors.

The communication module 220 performs data transmission/reception incommunication between the external electronic device 104 and/or theserver 106 which may be connected with the electronic device 201 throughthe network 162. The communication module 220 includes a cellular module221, a Wi-Fi module 223, a BT module 225, a global navigation satellitesystem (GNSS) or GPS module 227, a NFC module 228, and a radio frequency(RF) module 229.

The cellular module 221 provides a voice call, a video call, a textservice, an internet service, and the like, through a communicationnetwork (e.g., LTE, LTE-A, CDMA, WCDMA, UMTS, WiBro, and GSM, and thelike). In addition, the cellular module 221 identifies and authenticatesthe electronic device 201 within the communication network by using theSIM card 224. The cellular module 221 may perform at least some offunctions that can be provided by the AP 210. For example, the cellularmodule 221 may perform at least some of multimedia control functions.

The cellular module 221 includes a communication processor (CP).Further, the cellular module 221 may be implemented, for example, withan SoC. Although elements, such as the cellular module 221 (e.g., theCP), the memory 230, and the power management module 295 are illustratedas separate elements with respect to the AP 210 in FIG. 2, the AP 210may also be implemented such that at least one part (e.g., the cellularmodule 221) of the aforementioned elements is included in the AP 210.

The AP 210 or the cellular module 221 loads an instruction or data,which is received from each non-volatile memory connected thereto or atleast one of different elements, to a volatile memory and processes theinstruction or data. In addition, the AP 210 or the cellular module 221stores data, which is received from at least one of different elementsor generated by at least one of different elements, into thenon-volatile memory.

Each of the Wi-Fi module 223, the BT module 225, the GNSS module 227,and the NFC module 228 includes a processor for processing datatransmitted/received through a corresponding module. Although thecellular module 221, the Wi-Fi module 223, the BT module 225, the GNSSmodule 227, and the NFC module 228 are illustrated in FIG. 2 as separateblocks, at least some (e.g., two or more) of the cellular module 221,the Wi-Fi module 223, the BT module 225, the GNSS module 227, and theNFC module 228 may be included in one integrated chip (IC) or ICpackage. For example, at least some of processors corresponding to thecellular module 221, the Wi-Fi module 223, the BT module 225, the GNSSmodule 227, and the NFC module 228 (e.g., a communication processorcorresponding to the cellular module 221 and a Wi-Fi processorcorresponding to the Wi-Fi module 223) may be implemented with an SoC.

The RF module 229 transmits/receives data, for example an RF signal. TheRF module 229 may include, for example, a transceiver, a power ampmodule (PAM), a frequency filter, a low noise amplifier (LNA), and thelike. In addition, the RF module 229 may further include a component fortransmitting/receiving a radio wave on a free space in wirelesscommunication, for example, a conductor, a conducting wire, and thelike. Although it is illustrated in FIG. 2 that the cellular module 221,the Wi-Fi module 223, the BT module 225, the GNSS module 227, and theNFC module 228 share one RF module 229, at least one of the cellularmodule 221, the Wi-Fi module 223, the BT module 225, the GNSS module227, or the NFC module 228 may transmit/receive an RF signal via aseparate RF module.

The SIM card 224 may be inserted into a slot formed at a specificlocation of the electronic device 201. The SIM card 224 includes uniqueidentification information (e.g., an integrated circuit card identifier(ICCID)) or subscriber information (e.g., an international mobilesubscriber identity (IMSI)).

The memory 230 includes an internal memory 232 or an external memory 234and may be volatile or non-volatile memory.

The internal memory 232 may include, for example, at least one of avolatile memory (e.g., a dynamic random access memory (DRAM), a staticRAM (SRAM), a synchronous dynamic RAM (SDRAM), and the like) or anon-volatile memory (e.g., a one time programmable read only memory(OTPROM), a programmable ROM (PROM), an erasable and programmable ROM(EPROM), an electrically erasable and programmable ROM (EEPROM), a maskROM, a flash ROM, a not and (NAND) flash memory, a not or (NOR) flashmemory, and the like). The internal memory 232 may be a solid statedrive (SSD).

The external memory 234 may include a flash drive, and may furtherinclude, for example, compact flash (CF), secure digital (SD), micro-SD,mini-SD, extreme digital (xD), memory stick, and the like. The externalmemory 234 may be operatively coupled to the electronic device 201 viavarious interfaces.

The electronic device 201 may further include a storage unit (or astorage medium), such as a hard drive, solid state drive, or flashstorage.

The sensor modu1e 240 measures a physical quantity or detects anoperation state of the electronic device 201, and converts the measuredor detected information into an electric signal. The sensor modu1e 240includes, for example, at least one of a gesture sensor 240A, a gyrosensor 240B, a barometric pressure sensor or air sensor 240C, a magneticsensor 240D, an acceleration sensor 240E, a grip sensor 240F, aproximity sensor 240G, a color sensor 240H (e.g., a red, green, blue(RGB) sensor), a biometric sensor 2401, a temperature/humidity sensor240J, an illumination/illuminance sensor 240K, an ultraviolet (UV)sensor 240M or ultrasonic sensor 240N.

The ultrasonic sensor 240N may include at least one ultrasonictransducer. The ultrasonic sensor 240N may include a contact typeultrasonic transducer (for example, an enclosed type ultrasonictransducer) and a non-contact type ultrasonic transducer (for example, aresonant type ultrasonic transducer), each of which are described ingreater detail below. The contact type ultrasonic transducer and thenon-contact type ultrasonic transducer may be controlled to beexclusively or simultaneously operated under a control of the processors120.

Additionally or alternatively, the sensor modu1e 240 may include, forexample, an E-node sensor, an electromyography (EMG) sensor, anelectroencephalogram (EEG) sensor, an electrocardiogram (ECG) sensor, afingerprint sensor, and the like.

The sensor module 240 may further include a control circuit forcontrolling at least one or more sensors included therein.

The input device 250 includes a touch panel 252, a (digital) pen sensor254, a key 256, or an ultrasonic input unit 258.

The touch panel 252 recognizes a touch input, for example, by using atleast one of an electrostatic type configuration, a pressure-sensitivetype configuration, or an ultrasonic type configuration. The touch panel252 may further include a control circuit. In the instance where thetouch panel is of the electrostatic type, not only is physical contactrecognition possible, but proximity recognition is also possible. Thetouch panel 252 may further include a tactile layer, which provides theuser with a tactile reaction.

The (digital) pen sensor 254 may include, for example, a recognitionsheet which is a part of the touch panel or is separated from the touchpanel. The key 256 may include, for example, a physical button, anoptical key, or a keypad. The ultrasonic input device 258 may detectultrasonic waves generated by an input tool through the microphone 288,and may confirm data corresponding to the detected ultrasonic waves.

The (digital) pen sensor 254 may be implemented, for example, by usingthe same or similar method of receiving a touch input of the user or byusing an additional sheet for recognition.

The key 256 may be, for example, a physical button, an optical key, akeypad, or a touch key.

The ultrasonic input unit 258 is a device by which the electronic device201 detects a reflected sound wave through a microphone 288 and iscapable of radio recognition. For example, an ultrasonic signal, whichmay be generated by using a pen, may be reflected off an object anddetected by the microphone 288.

The electronic device 201 may use the communication module 220 toreceive a user input from an external device (e.g., a computer or aserver) connected thereto.

The display 260 includes a panel 262, a hologram 264, or a projector266.

The panel 262 may be, for example, a liquid-crystal display (LCD), anactive-matrix organic light-emitting diode (AM-OLED), and the like. Thepanel 262 may be implemented, for example, in a flexible, transparent,or wearable manner. The panel 262 may be constructed as one module withthe touch panel 252.

The hologram device 264 uses an interference of light and displays astereoscopic image in the air.

The projector 266 displays an image by projecting a light beam onto ascreen. The screen may be located inside or outside the electronicdevice 201.

The display 260 may further include a control circuit for controllingthe panel 262, the hologram device 264, or the projector 266.

The interface 270 includes, for example, an HDMI 272, a USB 274, anoptical communication interface 276, or a D-subminiature (D-sub) 278.The interface 270 may be included, for example, in the communicationinterface 160 of FIG. 1. Additionally or alternatively, the interface270 may include, for example, mobile high-definition link (MHL),SD/multi-media card (MMC) or infrared data association (IrDA).

The audio module 280 bilaterally converts a sound and an electricsignal. At least some elements of the audio module 280 may be includedin the input/output interface 150 of FIG. 1. The audio module 280converts sound information which is input or output through a speaker282, a receiver 284, an earphone 286, the microphone 288, and the like.

The speaker 282 may output a signal of an audible frequency band and asignal of an ultrasonic frequency band. Reflected waves of an ultrasonicsignal emitted from the speaker 282 may be received, or a signal of anexternal audible frequency band may also be received.

The camera module 291 is a device for image and video capturing, and mayinclude one or more image sensors (e.g., a front sensor or a rearsensor), a lens, an image signal processor (ISP), or a flash (e.g., anLED or a xenon lamp). In certain instances, it may prove advantageous toinclude two or more camera module.

The power management module 295 manages power of the electronic device201. The power management module 295 may include a power managementintegrated circuit (PMIC), a charger IC, or a battery gauge.

The PMIC may be placed inside an IC or SoC semiconductor. Charging isclassified into wired charging and wireless charging. The charger ICcharges a battery, and prevents an over-voltage or over-current flowfrom a charger. The charger IC includes a charger IC for at least one ofthe wired charging and the wireless charging.

The wireless charging may be classified, for example, into a magneticresonance type, a magnetic induction type, and an electromagnetic type.An additional circuit for the wireless charging, for example, a coilloop, a resonant circuit, a rectifier, and the like, may be added.

The battery gauge measures, for example, a residual quantity of thebattery 296 and a voltage, current, and temperature during charging. Thebattery 296 stores or generates electricity and supplies power to theelectronic device 201 by using the stored or generated electricity. Thebattery 296 may include a rechargeable battery or a solar battery.

The indicator 297 indicates a specific state, for example, a bootingstate, a message state, a charging state, and the like, of theelectronic device 201 or a part thereof (e.g., the AP 210).

The motor 298 converts an electric signal into a mechanical vibration.For example, the motor 298 may provide mechanical feedback to the user,such as when the user taps on the display.

The electronic device 201 includes a processing unit (e.g., a GPU) forsupporting mobile TV. The processing unit for supporting mobile TVprocesses media data according to a protocol of, for example, digitalmultimedia broadcasting (DMB), digital video broadcasting (DVB), mediaflow, and the like.

Each of the aforementioned elements of the electronic device 201 mayconsist of one or more components, and names thereof may vary dependingon a type of the electronic device 201. The electronic device 201 mayinclude at least one of the aforementioned elements. Some of theelements may be omitted, or additional other elements may be furtherincluded. In addition, some of the elements of the electronic device 201may be combined and constructed as one entity, so as to equally performfunctions of corresponding elements before combination.

At least some parts of a device (e.g., modules or functions thereof) ormethod (e.g., operations) may be implemented with an instruction storedin a computer-readable storage media for example. The instruction may beexecuted by the processor 210, to perform a function corresponding tothe instruction. The computer-readable storage media may be, forexample, the memory 230. At least some parts of the programming modulemay be implemented (e.g., executed), for example, by the processor 210.At least some parts of the programming module may include modules,programs, routines, a set of instructions, processes, and the like, forperforming one or more functions. FIG. 3 illustrates a perspective viewof an electronic device 300 according to various embodiments of thepresent disclosure.

Referring to FIG. 3, a display 301 may be installed on the front 307 ofthe electronic device 300. A speaker device 302 for outputting, forexample, a phone call or music may be installed on the upper side of thedisplay 301. A microphone device 303 for transmitting an electronicdevice user's voice to the counterpart may be installed on the lowerside of the display 301.

According to an embodiment, components for performing various functionsof the electronic device 300 may be arranged around the speaker device302. The components may include at least one sensor module 304. Thesensor module 304 may include, for example, at least one of anilluminance sensor (e.g., optical sensor), a proximity sensor, aninfrared sensor, or an ultrasonic sensor. According to an embodiment,the components may also include a camera device 305. According to anembodiment, the components may also include an LED indicator 306 forinforming the user of the state information of the electronic device300.

According to various embodiments, the electronic device 300 may includea metal bezel 310 (e.g., may serve as at least a part of a metalhousing). According to an embodiment, the metal bezel 310 may bedisposed along the outer periphery of the electronic device 300 and maybe disposed to extend to at least one area of the back of the electronicdevice 300, which is connected to the outer periphery. According to anembodiment, the metal bezel 310 may define the thickness of theelectronic device along the outer periphery of the electronic device 300and may be formed in a loop shape. Without being limited thereto,however, the metal bezel 310 may be formed in such a manner that themetal bezel contributes to at least a part of the thickness of theelectronic device 300. According to an embodiment, the metal bezel 310may be disposed only in at least one area of the outer periphery of theelectronic device 300. According to an embodiment, the metal bezel 310may include one or more cut-off portions 315, and a unit bezel part 313separated by the cut-off portions 315 may be used as an antennaradiator.

According to various embodiments, the metal bezel 310 may have a loopshape along the outer periphery of the electronic device 300 and may bedisposed to serve as the entirety or a part of the thickness of theelectronic device 300. According to an embodiment, when the electronicdevice 300 is viewed from the front, the metal bezel 310 may beconstituted by a right bezel part 311, a left bezel part 312, the upperbezel part 313, and a lower bezel part 314. Here, the above-describedupper bezel part 313 may serve as a unit bezel part that is formed by apair of cut-off portions 315.

According to various embodiments, an antenna device may be disposed inthe upper area (area A) of the electronic device 300. According to anembodiment, the upper bezel part 313 may be used as an main antennaradiator by virtue of the pair of cut-off portions 315. According to anembodiment, the upper bezel part 313 may serve as an antenna radiatorthat operates in at least two operating frequency bands according tofeeding positions. According to an embodiment, the right bezel part 311or the left bezel part 312 may also be used as the main antennaradiator.

According to various embodiments, an electrical length from a feedingpart of the metal bezel, which is used as an antenna radiator, may beadjusted through a ground line of a side key assembly that is disposedon the lateral side of the electronic device. This may be advantageouswhen the metal bezel is used to implement an antenna radiator having anoperating frequency band that has to be grounded to the position inwhich the side key assembly is installed.

In the exemplary embodiment of the present disclosure, the cut-offportions 315 are formed on the upper portion of the electronic device300, and the right or left non-segmented bezel part 311 or 312 withrespect to the upper bezel part 313 and the cut-off portions 315 is usedas an antenna radiator. However, if space is allowed, antenna radiatorsthat have the same configuration as that described above may also beprovided in the lower area (area B) of the electronic device.

According to various embodiments, the right bezel part 311 may be usedas a multiband antenna radiator that operates in different bands by atleast two ground areas that are grounded to different positions on thenon-segmented part. Without being limited thereto, however, the leftbezel part 312 may also be used as a multiband antenna radiator thatoperates in different bands by at least two ground areas that aregrounded to different positions on the non-segmented part.

According to various embodiments, a form that is used as the mainantenna in the area (area C) of the left bezel part 312 and isconfigured by the ground area (area C) of the right bezel part 311 maybe possible. According to an embodiment, the left bezel part, which is aunit bezel part, may serve as an antenna radiator by virtue of anotherpair of cut-off portions 316.

In the exemplary embodiment of the present disclosure, the cut-offportions 315 are formed on the upper portion of the electronic device300, and the right or left non-segmented bezel part 311 or 312 withrespect to the upper bezel part 313 and the cut-off portions 315 is usedas an antenna radiator. However, if space is allowed, antenna radiatorsthat have the same configuration as that described above may also beprovided in the lower area (area B) of the electronic device.

FIG. 4A illustrates a configuration of an antenna device according tovarious embodiments of the present disclosure.

According to various embodiments, a metal bezel 410 of FIG. 4A is anillustration of a metal bezel that is similar to, or different from, themetal bezel 310 of FIG. 3.

Referring to FIG. 4A, the metal bezel 410 may include a right bezel part411, a left bezel part 412, an upper bezel part 413, and a lower bezelpart 414, when viewed from the front. According to an embodiment, theupper bezel part 413 may be maintained to be electrically isolated fromthe right bezel part 411 and the left bezel part 412 by a pair ofcut-off portions 415 that are formed with a predetermined intervaltherebetween. According to an embodiment, the pair of cut-off portions415 may be formed of a dielectric material. According to an embodiment,the pair of cut-off portions 415 may be formed in such a manner that asynthetic resin is double-injection molded, or insert molded, into themetal bezel 410.

According to various embodiments, a feeding piece 4131 may be integrallyformed with the upper bezel part 413 and may be feed-connected to afeeing part of a PCB 400. According to an embodiment, the feeding piece4131 of the upper bezel part 413 may be feed-connected to the feedingpart of the PCB 400 only by installing the PCB 400 in the electronicdevice, or may be electrically connected to the feeding part by aseparate electrical connection member (e.g., a C-clip, etc.).

According to various embodiments, a feeding piece 4111 may protrudeinward from the tip end of the right bezel part 411 that is separated bythe cut-off portion 415. According to an embodiment, the feeding piece4111 of the right bezel part 411 may also be feed-connected to thefeeding part of the PCB 400.

According to various embodiments, the right bezel part 411 may include apair of ground pieces 4112 and 4113 that is formed in differentpositions. According to an embodiment, the pair of ground pieces 4112and 4113 may be integrally formed with the metal bezel 410 when themetal bezel 410 is formed, and may be grounded to the ground part of thePCB. According to an embodiment, the ground pieces 4112 and 4113 mayalso be electrically connected to the ground part of the PCB only byinstalling the PCB in the electronic device, or may be electricallyconnected to the ground part by a separate electrical connection member.

According to various embodiments, the right bezel part 411 may serve asan a multiband antenna radiator that operates in a desired operatingfrequency band by adjusting the physical length from the feeding piece4111 to the pair of ground pieces 4112 and 4113. According to anembodiment, the right bezel part 411 may serve as an antenna radiatorthat operates in a first operating band corresponding to the physicallength from the feeding piece to the first ground piece. According to anembodiment, the right bezel part 411 may serve as an antenna radiatorthat operates in a second operating band corresponding to the physicallength from the feeding piece to the second ground piece. According toan embodiment, at least two ground pieces 4112 and 4113 may be disposedin different positions in the same direction from the feeding piece4111, i.e. the ground pieces 4112 and 4113 are disposed on the same sideas the feeding piece 4111. According to an embodiment, the operatingfrequency band formed as an antenna radiator by the first ground piece4112 may operate in a frequency band lower than the operating frequencyband formed as an antenna radiator by the second ground piece, when thedistance between the first ground piece 4112 and the feeding piece 4111is shorter than the distance between the second ground piece 4113 andthe feeding piece 4111.

The above-described feeding piece 4111 and ground pieces 4112 and 4113may be conductive connection pieces configured separately from the metalbezel 410. According to an embodiment, the above-described electricalconnection member may include one or more of various members, such as athin cable (e.g., metal wire), a flexible printed circuit, a C-clip, aconductive gasket, etc.

According to various embodiments, the right bezel part may furtherinclude at least one other ground piece 4114. According to anembodiment, the ground piece 4114 may not be grounded to the PCB, but ina case where additional resonance is required in another band of theantenna radiator, the ground piece 4114 may be electrically connectedwith the ground part of the PCB by a separate electrical connectionmember (such as a C-clip, etc.) to implement the additional resonance.

According to various embodiments, an antenna radiator that operates in adesired band may be implemented by adjusting the physical length from afeeding piece to at least one ground piece. For example, as listed inTable 1 below, when the physical length from the feeding piece to theground piece is 118 mm, GSM850, GSM900, WCDMA5, WCDMA8, LTE5, LTE8,LTE17, LTE20, LTE28, and the like, which operate in a relatively lowoperating frequency band of 700 MHz to 1 GHz, may be supported.According to an embodiment, when the physical length from the feedingpiece to the ground piece is 65 mm, DSC1800, PCS1900, WCDMA1, WCDMA2,WCDMA4, LTE1, LTE2, LTE3, LTE4, LTE7, LTE40, and the like, which operatein a relatively high operating frequency band of 1.7 GHz to 2.8 GHz, maybe supported.

TABLE 1 Low Band High Band Support Band GSM850, GSM900, DCS1800,PCS1900, WCDMA5, WCDMA8, WCDMA1, WCDMA2, LTE5, LTE8, LTE17, WCDMA4,LTE1, LTE2, LTE20, LTE28 LTE3, LTE4, LTE7, LTE40 Frequency 700 MHz~1 GHz1.7 GHz~2.8 GHz band Metal Length 118 mm 65 mm Value

FIG. 4B illustrates the configuration of the PCB 400 according tovarious embodiments of the present disclosure.

Referring to FIG. 4B, the feeding piece (4111 of FIG. 4A) and the groundpieces (4112 and 4113 of FIG. 4A) of the right bezel part (411 of FIG.4A) may be electrically connected to the PCB 400 and may be grounded tothe ground part of the PCB only by mounting the PCB 400 in the housingthat includes the metal bezel. According to an embodiment, the PCB 400may include a feeding pad 410 and ground pads 420 and 430 that areformed to be exposed in the positions that correspond to the feedingpiece (4111 of FIG. 4A) and the ground pieces (4112 and 4113 of FIG. 4A)of the right bezel part (411 of FIG. 4A). According to an embodiment,the feeding pad 410 may be electrically connected to the feeding part ofthe PCB 400 by a pattern. According to an embodiment, the ground pads420 and 430 may also be electrically connected to the feeding part ofthe PCB 400 by a pattern. Without being limited thereto, however, thefeeding pad 410 and the ground pads 420 and 430 may be electricallyconnected to the feeding part and the ground parts of the PCB by a thincable (e.g., metal wire) or a separate electrical connection member.

According to various embodiments, in order to form an antenna radiator,the feeding piece (4111 of FIG. 4a ) and the ground pieces (4112 and4113 of FIG. 4A) are formed on the right bezel part (411 of FIG. 4A) ofthe metal bezel (410 of FIG. 4A) and are electrically connected to thefeeding pad 410 and the ground pads 420 and 430 of the PCB,respectively, but the present disclosure is not limited thereto. Forexample, the electrical connection structure for forming an antennaradiator may be formed in various areas, such as the left bezel part(412 of FIG. 4A) of the metal bezel (410 of FIG. 4A). Further, thecut-off portions may also be formed in various positions to configurevarious segment forms of various metal bezels.

FIG. 5A illustrates a radiation flow of an antenna device according tovarious embodiments of the present disclosure. FIGS. 5B and 5C areequivalent circuit diagrams illustrating an electric-shock preventioncircuit and a matching circuit according to various embodiments of thepresent disclosure.

According to various embodiments, a metal bezel 510 of FIG. 5A is anillustration of a metal bezel that is similar to, or different from, themetal bezel 410 of FIG. 4A.

Referring to FIG. 5A, an upper bezel part 513, which is separated as aunit bezel by a pair of cut-off portions 515, may be electricallyfeed-connected to a feeding part 504 of a PCB by a feeding piece 5131.According to an embodiment, a feeding line 5041 may split so as to begrounded to a ground part 505 of the PCB. According to an embodiment,the upper bezel part 513 may be used as the main antenna radiator of theelectronic device.

According to various embodiments, a feeding piece 5111 formed on the tipend of a right bezel part 511 (in the position closest to the cut-offportion) may be electrically connected to a feeding pad 520 of the PCB.According to an embodiment, the feeding pad 520 may be electricallyconnected to a feeding part 501 of the PCB. According to an embodiment,a first ground piece 5112 formed in a position that is spaced apredetermined distance apart from the feeding piece 5111 may beelectrically connected to a first ground pad 530 of the PCB. Accordingto an embodiment, the first ground pad 530 may be electrically connectedto a first ground part 502 of the PCB. According to an embodiment, asecond ground piece 5113 formed in a position that is spaced apredetermined distance apart from the feeding piece 5111 may beelectrically connected to a second ground pad 540 of the PCB. Accordingto an embodiment, the second ground pad 540 may be electricallyconnected to a second ground part 503 of the PCB. In this case, the twoground pieces 5112 and 5113 may be disposed in different positions inthe same direction from the feeding piece 5111, for example, the twoground pieces 5112 and 5113 may be on the same side of the feeding piece5111, shown in FIG. 5A as being to the right of the feeding piece 5111.According to an embodiment, the first ground piece 5112 may be disposedcloser to the feeding piece 5111 than the second ground piece 5113.

Accordingly, the antenna radiator formed by the right bezel part 511 mayinclude a first loop-type radiation area (area {circle around (1)}ofFIG. 5A) in which the feeding part 501 of the PCB is electricallyconnected to the feeding piece 5111 and is grounded to the first groundpart 502 of the PCB through the first ground piece 5112 of the rightbezel part 511. Further, the antenna radiator formed by the right bezelpart 511 may include a second loop-type radiation area (area {circlearound (2)} of FIG. 5A) in which the feeding part 501 of the PCB iselectrically connected to the feeding piece 5111 and is grounded to thesecond ground part 503 of the PCB through the second ground piece 5113of the right bezel part 511.

According to various embodiments, the antenna device may further includeelectric-shock prevention circuits 5201, 5301, and 5401 for preventingan electric shock and discharging static electricity, for example,electro-static discharge (ESD) and matching circuits 5202, 5302, and5402 for tuning the antenna radiator to a desired frequency band sincethe feeding pad 520 and the ground pads 530 and 540 of the PCB makedirect physical contact with the metal bezel 510 that forms the exteriorof the electronic device. According to an embodiment, as illustrated inFIGS. 5B and 5C, the electric-shock prevention circuit 5201 and thematching circuit 5202 may be further provided on a line (pattern) 5011between the feeding pad 520 and the feeding part 501 of the PCB.According to an embodiment, the electric-shock prevention circuits 5301and 5401 and the matching circuits 5302 and 5402 may be further providedon corresponding lines (patterns) 5021 and 5031 between the ground pads530 and 540 and the corresponding ground parts 502 and 503 of the PCB.

Although not illustrated, an electric-shock prevention circuit and amatching circuit may also be included on the line 5041 that iselectrically connected to the upper bezel part 513, which is used as themain antenna radiator of the electronic device, and the feeding part 504of the PCB.

FIGS. 6A to 6C are graphs illustrating a VSWR by the antenna device ofFIG. 4A that operates in individual operating bands, according tovarious embodiments of the present disclosure.

FIG. 6A illustrates an operating frequency band that is secured througha first loop-type antenna radiation area, i.e. area {circle around (1)}of FIG. 5A. In this case, it may be identified that there is no poll dueto the short physical length of the antenna. For example, it may beidentified that there is no poll in a low band of 700 MHz to 1 GHz.

FIG. 6B illustrates an operating frequency band that is secured througha second loop-type antenna radiation area, i.e. area {circle around (2)}of FIG. 5A. In this case, it may be identified that the resonance isformed in a low band and there is no poll. For example, it may beidentified that there is no poll in a mid-band of 1.5 GHz to 1.9 GHz.

FIG. 6C illustrates an operating frequency band that is simultaneouslysecured through the first loop-type antenna radiation area and thesecond loop-type antenna radiation area. In this case, it may beidentified that the resonance is formed in a low band, in a mid-band,and in a high band, and it can be seen that the bandwidth expands in thelow band.

FIG. 7 illustrates a configuration of an antenna device according tovarious embodiments of the present disclosure.

Referring to FIG. 7, a multiband antenna is illustrated in which threeground pieces 7112, 7113, and 7114 are formed in different positions inthe same direction from a feeding piece 7111 of a right bezel part 711,for example, the three ground pieces or connectors 7112, 7113, and 7114may be on the same side of the feeding piece 7111.

In the description of FIG. 7, a detailed description of an upper bezelpart 713 will be omitted, which includes a feeding piece 7131 and isfeed-connected to a feeding part 704 of a PCB and grounded to a groundpart 705 of the PCB through a line that branches off from a feeding line7041.

According to various embodiments, the feeding piece 7111 formed on thetip end of the right bezel part 711 (in the position closest to acut-off portion) may be electrically feed-connected to a feeding part701 of the PCB. According to an embodiment, the first ground piece 7112formed in a position that is spaced a predetermined distance apart fromthe feeding piece 7111 may be electrically connected to a first groundpart 702 of the PCB. According to an embodiment, the second ground piece7113 formed in a position that is spaced a predetermined distance apartfrom the feeding piece 7111 may be electrically connected to a secondground part 703 of the PCB. According to an embodiment, the third groundpiece 7114 formed in a position that is spaced a predetermined distanceapart from the feeding piece 7111 may be electrically connected to athird ground part 706 of the PCB. In this case, the three ground pieces7112, 7113, and 7114 may be disposed in different positions in the samedirection from the feeding piece 7111. According to an embodiment, thefirst ground piece 7112 may be disposed closer to the feeding piece 7111than the second ground piece 7113. According to an embodiment, thesecond ground piece 7113 may be disposed closer to the feeding piece7111 than the third ground piece 7114.

Accordingly, the antenna radiator formed by the right bezel part 711 mayinclude a first loop-type radiation area (area {circle around (1)} ofFIG. 7) in which the feeding part 701 of the PCB is electricallyconnected to the feeding piece 7111 and is grounded to the first groundpart 702 of the PCB through the first ground piece 702 of the rightbezel part 711. Further, the antenna radiator formed by the right bezelpart 711 may include a second loop-type radiation area (area {circlearound (2)} of FIG. 7) in which the feeding part 701 of the PCB iselectrically connected to the feeding piece 7111 and is grounded to thesecond ground part 703 of the PCB through the second ground piece 7113of the right bezel part 711. In addition, the antenna radiator formed bythe right bezel part 711 may include a third loop-type radiation area(area {circle around (3)} of FIG. 7) in which the feeding part 701 ofthe PCB is electrically connected to the feeding piece 7111 and isgrounded to the third ground part 706 of the PCB through the thirdground piece 7114 of the right bezel part 711.

According to various embodiments, the non-segmented right bezel part 711may serve as a multiband antenna radiator in which multiple resonancesare formed in different frequency bands by the electrical lengths of thefirst, second, and third ground pieces 7112, 7113, and 7114 that aredisposed in the different positions in the same direction from thefeeding piece 7111.

Although not illustrated, it is apparent that electric-shock preventioncircuits and frequency adjustment matching circuits, similar to thoseillustrated in FIG. 5A, may also be provided between the feeding pieces7131 and 7111 and the ground pieces 7112, 7113, and 7114, which areelectrically connected to the upper bezel part 713 and the right bezelpart 711, and the corresponding feeding parts 701 and 704 and groundparts 702, 703, and 704 of the PCB.

FIG. 8 illustrates a configuration of an antenna device according tovarious embodiments of the present disclosure.

Referring to FIG. 8, a multiband antenna is illustrated in which threeground pieces 8112, 8113, and 8114 are formed in different positions indifferent directions from a feeding piece 8111 of a right bezel part811, as opposed to those illustrated in FIGS. 4A and 5A. Differentdirection means that the feeding piece 8111 is disposed in between theground pieces 8112, 8113, and 8114, as shown in FIG. 8.

According to various embodiments, an upper bezel part 813, which isseparated as a unit bezel by a pair of cut-off portions 815, may beelectrically feed-connected to a feeding part 804 of a PCB by a feedingpiece 8131. According to an embodiment, a feeding line 8041 may split soas to be grounded to a ground part 805 of the PCB. According to anembodiment, the upper bezel part 813 may be used as the main antennaradiator of the electronic device.

According to various embodiments, a feeding piece 8111 may be formed ina suitable place of the non-segmented right bezel part 811. According toan embodiment, the feeding piece 8111 may be disposed in a correspondingposition of the right bezel part 811, which is a predetermined distanceaway from the cut-off portion 815 on the border between the upper bezelpart 813 and the right bezel part 811. According to an embodiment, thefeeding pad 8111 may be electrically feed-connected to a feeding part801 of the PCB.

According to various embodiments, the first ground piece 8112 formed ina position that is spaced a predetermined distance apart from thefeeding part 801 in a direction toward the cut-off portion 815 may beelectrically connected to a first ground part 807 of the PCB. Accordingto an embodiment, the second ground piece 8113 formed in a position thatis spaced apart from the first feeding piece 8111 in the directionopposite to that toward the first ground piece 8112 may be electricallyconnected to a second ground part 808 of the PCB. According to anembodiment, the third ground piece 8114 formed in a position that isspaced a predetermined distance apart from the first feeding piece 8111in the same direction as that of the second ground piece 8113 may beelectrically connected to a third ground part 809 of the PCB. In thiscase, the operating frequency bands formed by the three ground pieces8112, 8113, and 8114 may be adjusted to desired frequency bandsaccording to the position of the feeding piece 811.

According to various embodiments, the antenna radiator formed by theright bezel part 811 may include a first loop-type radiation area (area{circle around (1)} of FIG. 8) in which the feeding part 801 of the PCBis electrically connected to the feeding piece 8111 and is grounded tothe first ground part 807 of the PCB through the first ground piece 8112of the right bezel part 811. Further, the antenna radiator formed by theright bezel part 811 may include a second loop-type radiation area (area{circle around (2)} of FIG. 8) in which the feeding part 801 of the PCBis electrically connected to the feeding piece 8111 and is grounded tothe second ground part 808 of the PCB through the second ground piece8113 of the right bezel part 811. In addition, the antenna radiatorformed by the right bezel part 811 may include a third loop-typeradiation area (area {circle around (3)} of FIG. 8) in which the feedingpart 801 of the PCB is electrically connected to the feeding piece 8111and is grounded to the third ground part 809 of the PCB through thethird ground piece 8114 of the right bezel part 811.

According to various embodiments, the non-segmented right bezel part 811may serve as a multiband antenna radiator in which multiple resonancesare formed in different frequency bands by the electrical lengths of thefirst, second, and third ground pieces 8112, 8113, and 8114 that aredisposed in the different positions in the different directions from thefeeding piece 8111.

Although not illustrated, it is apparent that electric-shock preventioncircuits and frequency adjustment matching circuits, similar to thoseillustrated in FIG. 5A, may also be provided between the feeding pieces8131 and 8111 and the ground pieces 8112, 8113, and 8224, which areelectrically connected to the upper bezel part 813 and the right bezelpart 811, and the corresponding feeding parts 801 and 804 and groundparts 807, 808, and 809 of the PCB.

Various embodiments may provide an electronic device that includes: anexternal housing that includes a first surface directed in a firstdirection, a second surface directed in a second direction opposite tothe first direction, and a side surface configured to surround at leasta part of the space between the first and second surfaces; a printedcircuit board (PCB) disposed within the external housing; acommunication circuit disposed on the printed circuit board; aconductive member configured to form a part of the side surface of theexternal housing; a non-conductive member configured to form anotherpart of the side surface of the external housing and to electricallyisolate the conductive member while making contact with the conductivemember; and a ground member disposed within the external housing, andthe conductive member may include: a first portion located a firstdistance from the non-conductive member and electrically connected withthe communication circuit; a second portion located a second distance,which is larger than the first distance, from the non-conductive memberand electrically connected with the ground member; and a third portionlocated a third distance, which is larger than the second distance, fromthe non-conductive member and electrically connected with the groundmember.

According to various embodiments, the communication circuit may beconfigured to transmit a first signal having a first frequency band tothe outside using a portion between the first and second portions of theconductive member and to transmit a second signal having a secondfrequency band to the outside using a portion between the first andthird portions of the conductive member.

According to various embodiments, the first frequency band may include afrequency higher than the second frequency band.

According to various embodiments, the side surface of the externalhousing may include a first side and a second side longer than the firstside; the conductive member may form at least a part of the first sideand at least a part of the second side; and another conductive memberdisposed to be spaced apart from the conductive member may form at leastone other part of the first side.

Various embodiments may provide an electronic device that includes: ametal member configured to have a length that contributes to at least apart of the electronic device; and a printed circuit board (PCB)configured to be feed-connected to a preset position of the metal memberin order to apply the metal member as an antenna radiator, and at leasttwo positions of the metal member that differ from the feeding positionmay be grounded through the PCB.

According to various embodiments, the at least two ground positions maybe disposed in different positions in the same direction with respect tothe feeding position of the metal member.

According to various embodiments, the metal member may adjust theoperating frequency band of the antenna radiator by adjusting theelectrical length between the feeding position and the at least twogrounded positions.

According to various embodiments, the antenna radiator that has theground position disposed close to the feeding position may operate in arelatively low frequency band.

According to various embodiments, the at least two ground positions maybe disposed in different directions with respect to the feeding positionof the metal member.

According to various embodiments, the antenna radiator that has theground position disposed close to the feeding position may operate in arelatively low frequency band.

According to various embodiments, the metal member may be a metal bezelor a decoration member that is disposed such that at least a partthereof is exposed to the outside of the electronic device.

According to various embodiments, the electronic device may furtherinclude a display, and the metal member may be disposed in such a mannerthat the metal member surrounds at least a part of the outer peripheryof the display.

According to various embodiments, the metal member may be formed in aclosed-loop type.

According to various embodiments, the electronic device may be awearable electronic device that is worn on a part of a user's body.

According to various embodiments, the feeding position and at least oneground position of the metal member may be electrically connected toeach other by the PCB and an electrical connection member.

According to various embodiments, the electrical connection member maybe at least one of a conductive poron tape, a conductive gasket, or aconductive tape.

Various embodiments may provide an electronic device that includes: ametal bezel formed in such a manner that the metal bezel surrounds atleast a part of the outer periphery of the electronic device; a printedcircuit board (PCB) configured to be feed-connected to a preset positionof the metal bezel in order to apply at least a part of the metal bezelas an antenna radiator; and at least two ground parts disposed indifferent positions in the same direction with respect to the feedingposition of the metal bezel, and the ground parts may be groundedthrough the PCB so that the metal bezel serves as a multiband antennaradiator that operates in different bands.

FIG. 9 illustrates a configuration of an antenna device according tovarious embodiments of the present disclosure.

Referring to FIG. 9, a metal bezel 910 may include a right bezel part911, a left bezel part 912, an upper bezel part 913, and a lower bezelpart 914, when viewed from the front. According to an embodiment, theupper bezel part 913 may be maintained to be electrically isolated fromthe right bezel part 911 and the left bezel part 912 by a pair ofcut-off portions 915 that are formed with a predetermined intervaltherebetween. According to an embodiment, the pair of cut-off portions915 may be formed of a dielectric material. According to an embodiment,the pair of cut-off portions 915 may be formed in such a manner that asynthetic resin is double-injection molded, or insert molded, into themetal bezel 910.

According to various embodiments, a feeding piece 9131 may be integrallyformed with the upper bezel part 913 and may be feed-connected to afeeing part of a PCB 900. According to an embodiment, the feeding piece9131 of the upper bezel part 913 may be feed-connected to the feedingpart of the PCB 900 only by installing the PCB 900 in the electronicdevice, or may be electrically connected to the feeding part by aseparate electrical connection member (e.g., a C-clip, etc.).

According to various embodiments, a feeding piece 9121 may protrudeinward from the tip end of the left bezel part 912 that is separated bythe cut-off portion 915. According to an embodiment, the feeding piece9121 of the left bezel part 912 may also be feed-connected to thefeeding part of the PCB.

According to various embodiments, the left bezel part 912 may beselectively or entirely electrically grounded to the PCB 900 indifferent positions of a side key assembly 920 that is disposed on theperiphery of the left bezel part 912 so that the electrical length bywhich the left bezel part 912 is grounded to the PCB 900 from thefeeding piece 9121 through the left bezel part 912 may be adjusted.

According to various embodiments, the side key assembly 920 may includea key button 923 disposed in such a manner that at least a part thereofis exposed through a side surface of the electronic device or protrudesfrom the side surface of the electronic device, a metal support plate922 that supports the key button 923, and a flexible printed circuitboard (FPCB) 921 disposed between the key button 923 and the supportplate 922. According to an embodiment, a PCB connection part 9215 thatincludes a ground pad 9216 is extracted toward the inside of theelectronic device such that the flexible printed circuit board 921 maybe electrically connected to the PCB 900.

According to various embodiments, the metal support plate 922 may beinstalled to make contact with the left bezel part 912 of the metalbezel 910 so as to be electrically connected thereto, and at least oneof area D or area E of the flexible printed circuit board 921 may beexposed to be electrically connected to the corresponding portion of thesupport plate 922, which enables the metal support plate to be groundedto the PCB 900.

According to various embodiments, when the left bezel part is groundedto the PCB 900 from the feeding piece 9121 through area D of FIG. 9, theelectrical length may restrain the left bezel part 912, which operatesas an antenna radiator, from implementing a desired operating frequencyband. However, when the ground position with the PCB 900 is changedthrough area E and area F of FIG. 9 via the side key assembly 920 (whenthe electrical length from the feeding piece through the left bezel partis changed), the left bezel part 912 may implement an antenna radiatorthat has a desired operating frequency band. According to an embodiment,when the ground position is determined to be area E of the side keyassembly 920, the electrical length becomes shorter than when the groundposition is determined to be area F so that it is possible to implementa relatively high desired operating frequency band.

The above-described feeding piece 9121 may be a conductive connectionpiece configured separately from the metal bezel 910.

According to various embodiments, at least one dielectric cut-offportion for separating at least one unit bezel part from the metal bezelmay be formed on at least one of the upper, lower, left, or right sidesof the metal bezel.

FIG. 10 illustrates an exploded perspective view of a side key assembly1020 according to various embodiments of the present disclosure.

According to various embodiments, the side key assembly 1020 of FIG. 10is an illustration of a side key assembly that is similar to, ordifferent from, the side key assembly 920 applied to the metal bezel 910of FIG. 9.

Referring to FIG. 10, the side key assembly 1020 may be disposed suchthat at least a part (e.g., a key body) of a key button is exposedthrough the outside (e.g., lateral side) of the electronic device, toperform a corresponding function (e.g., a volume up/down function, awake-up/sleep function, a power on/off function, etc.) of the electronicdevice by a user's pressing operation. The side key assembly 1020 mayinclude a flexible printed circuit board 1021 that includes a pair ofdome keys 10212 spaced apart from each other by a predetermineddistance, a metal support plate 1022 disposed on one side of theflexible printed circuit board 1021 to support the same, and a keybutton 1023 disposed on the opposite side of the flexible printedcircuit board 1021 to operate the dome keys 10212.

According to various embodiments, the key button 1023 may include: a keybody 10231 disposed to be exposed to the outside of the electronicdevice, or to partially protrude from the electronic device, wheninstalled; stoppers 10232 protruding from the opposite ends of the keybody 10231 so as to be supported by the inside of the electronic device;pressing protrusions 10233 protruding toward the inside of theelectronic device from the key body 10231 to press the dome keys 10212of the flexible printed circuit board 1021, which are disposed in thecorresponding position. According to an embodiment, the key body 10231may be formed of a synthetic resin material, a metal material, etc., andthe pressing protrusions 10233 may be formed of at least one of rubber,silicone, or urethane.

According to various embodiments, the flexible printed circuit board1021 may include a circuit body 10211 that has a length and a shapesubstantially similar to those of the key body 10231 and the dome keys10212 mounted on the circuit body 10211 so as to be pressed by thepressing protrusions 10233 of the key body 10231. According to anembodiment, a PCB connection part 10215 having a predetermined shape maybe extracted from the circuit body 10211 and may be finally electricallyconnected to the PCB. According to an embodiment, a ground pad 10216 tobe grounded to the PCB may be formed on the PCB connection part 10215.

According to various embodiments, the support plate 1022 may include aplate body 10221 for supporting the circuit body 10211 of the flexibleprinted circuit board 1021 and a first bezel fixing piece 10222 and asecond bezel fixing piece 10223 that are formed on the opposite ends ofthe plate body 10221 so as to be bent and are brought into physicalcontact with, and fixed to, the left bezel part of the metal bezel.According to an embodiment, the circuit body 10211 of the flexibleprinted circuit board 1021 may make surface-to-surface contact with theplate body 10221 of the support plate 1022 and may be fixed to thesupport plate 1022 through bonding, taping, etc.

According to various embodiments, the circuit body 10211 of the flexibleprinted circuit board 1021 may include a first exposed part 10213 and asecond exposed part 10214, the patterns of which are exposed, on theopposite ends thereof. The first exposed part 10213 and the secondexposed part 10214 may be electrically connected to the ground pad 10216of the PCB connection part 10215 through the internal pattern of theflexible printed circuit board 1021. According to an embodiment, thefirst exposed part 10213 may be electrically connected with the supportplate 1022 by physical contact around the first bezel fixing piece 10222of the plate body 10221. According to an embodiment, the second exposedpart 10214 may be electrically connected with the support plate 1022 byphysical contact around the second bezel fixing piece 10223 of the platebody 10221. According to an embodiment, the first exposed part 10213 andthe second exposed part 10214 may be electrically connected to the firstbezel fixing piece 10222 and the second bezel fixing piece 10223,respectively, or may be connected to one of the two bezel fixing pieces.

FIG. 11 illustrates a sectional view of major parts of a state in whicha side key assembly 1120 according to various embodiments of the presentdisclosure. As shown FIG. 11, the sectional view of major parts of thestate is mounted in an electronic device.

According to various embodiments, the side key assembly 1120 of FIG. 11is an illustration of a side key assembly that is similar to, ordifferent from, the side key assembly 1020 of FIG. 10.

Referring to FIG. 11, first, a key button 1123 of the side key assembly1120 may be installed in such a manner that a key body 11231 ispartially exposed through a left bezel part 1112 of a metal bezel 1110.Next, a support plate 1122 to which a flexible printed circuit board1121 is attached may be brought into physical contact with, and fixedto, the left bezel part 1112 through first and second bezel fixingpieces 11222 and 11223. Thereafter, a PCB connection part 11215 of theflexible printed circuit board 1121 may be extracted toward a PCB 1130and may be electrically connected to the PCB. In this case, a ground pad11216 of the PCB connection part 11215 may also be electricallyconnected to a ground part of the PCB 1130.

According to an embodiment, when one side or an opposite side of the keybody 11231 is pressed toward the inside of the electronic device afterthe side key assembly 1120 is completely assembled, pressing protrusions11233 may press dome keys 11212 of the flexible printed circuit board1121, the dome keys 11212 may be pressed while being supported by thesupport plate 1122 fixed to the left bezel part 1112, and signals of thedome keys may be transferred to the PCB through the PCB connection part11215, whereby the electronic device may perform the correspondingfunction.

According to various embodiments, two ground paths may be implementedfrom the left bezel part 1112 to the PCB 1130 through the side keyassembly 1120. According to an embodiment, the ground paths may include:a first ground path that travels through the support plate 1122 broughtinto contact with the left bezel part 1112 and reaches the ground partof the PCB 1130 through the ground pad 11216 of the PCB connection part11215 along a first exposed part 11213 of the flexible printed circuitboard 1121; and a second ground path that travels through the supportplate 1122 brought into contact with the left bezel part 1112 andreaches the ground part of the PCB 1130 through the ground pad 11216 ofthe PCB connection part 11215 along a second exposed part 11214 of theflexible printed circuit board 1121. By virtue of the above-describedfirst and/or second ground path, the left bezel part 1112 may beimplemented to be an antenna radiator that operates in differentfrequency bands due to a difference in the physical length from afeeding piece 11121.

FIGS. 12A and 12B are diagrams illustrating a change in a groundposition by a side key assembly according to various embodiments of thepresent disclosure.

The side key assembly 1220 of FIGS. 12A and 12B is an illustration of aside key assembly that is similar to, or different from, the side keyassemblies 920, 1020, and 1120 illustrated in FIGS. 9 to 11,respectively.

In the description of FIGS. 12A and 12B, a detailed description of anupper bezel part 1213 will be omitted, which includes a feeding piece12131 and is feed-connected to a feeding part 1250 of a PCB and groundedto a ground part 1252 of the PCB through a line that branches off from afeeding line 1251.

Referring to FIG. 12A, a feeding piece 12121 formed on the tip end of aleft bezel part 1212 (in the position closest to a cut-off portion) maybe electrically connected to a feeding pad 1230 of the PCB. According toan embodiment, the feeding pad 1230 may be electrically connected to afeeding part 1233 of the PCB.

According to various embodiments, a first radiation path formed by theleft bezel part 1212 may include a first loop-type radiation area (area{circle around (1)} of FIG. 12A) in which the feeding part 1233 of thePCB is electrically connected with the feeding piece 12121 and isgrounded to a ground part 1243 of the PCB through a first bezel fixingpiece 12213 of a support plate 1222 fixed to the left bezel part 1212and a ground pad 12216 formed on a PCB connection part 12215 of aflexible printed circuit board 1221.

Further, referring to FIG. 12B, a second radiation path formed by theleft bezel part 1212 may include a second loop-type radiation area (area{circle around (2)} of FIG. 12B) in which the feeding part 1233 of thePCB is electrically connected with the feeding piece 12121 and isgrounded to the ground part 1243 of the PCB through a second bezelfixing piece 12214 of the support plate 1222 fixed to the left bezelpart 1212 and the ground pad 12216 formed on the PCB connection part12215 of the flexible printed circuit board 1221.

According to various embodiments, the operating band formed by the firstradiation path may include a frequency band higher than the operatingband formed by the second radiation path. This is because the physicallength according to the ground position of the left bezel part of thefirst radiation path is shorter than that according to the groundposition of the left bezel part of the second radiation path.

The description of the present disclosure has been illustratively givenusing the two ground paths included in the side key assembly, but is notlimited thereto. For example, using various electronic components thathave one ground path or two or more ground paths, a metal bezel may beused as an antenna radiator that operates in various operating frequencybands.

According to various embodiments, an electric-shock prevention circuit1231 for preventing an electric shock and discharging static electricityelectro-static discharge (ESD) and a matching circuit 1232 for tuningthe antenna radiator to a desired frequency band may be further includedsince the feeding pad 1230 of the PCB makes direct physical contact witha metal bezel 1210 that forms the exterior of an electronic device.According to an embodiment, an electric-shock prevention circuit 1241and a matching circuit 1242 for tuning the antenna radiator to a desiredfrequency band may be further included between the ground pad 12216 andthe ground part 1243 of the PCB since the metal bezel 1210 makes directphysical contact with the PCB through the ground pad 12216.

Although not illustrated, an electric-shock prevention circuit and amatching circuit may also be included on the line 1251 that iselectrically connected to the upper bezel part 1213, which is used asthe main antenna radiator of the electronic device, and the feeding part1250 of the PCB.

According various embodiments, the metal bezel and a metal component maynot be directly connected to each other, but may be connected to eachother by a separate electrical connection member. According to anembodiment, the electrical connection member may include at least one ofa metal wire, a flexible printed circuit board, or a C-clip. Accordingto an embodiment, in a case where a C-clip is used, a recess may beformed in a corresponding portion of the metal bezel, the C-clip may beseated on and fixed to the recess, and a part of the C-clip may protrudeso as to be electrically connected to an electronic component or theground part of the PCB. According to an embodiment, the metal componentand the ground part of the PCB may also not be directly connected toeach other, but may be connected to each other by the above-describedelectrical connection member.

FIGS. 13A to 13C illustrate a VSWR by an antenna device of FIG. 9 thatoperates in individual operating bands according to various embodimentsof the present disclosure.

FIG. 13A illustrates a case where the ground position is implemented inarea D of FIG. 9. It can be seen that the resonant frequency of the leftbezel part, which is used as an antenna radiator, is not formed in thedesired band (800 MHz to 1 GHz).

FIG. 13B illustrates a case where the ground position is implemented bythe first radiation path of FIG. 12A. It can be seen that the resonantfrequency is formed in a high frequency band as the electrical length ofthe antenna becomes shorter.

FIG. 13C illustrates a case where the ground position is implemented bythe second radiation path of FIG. 12B. It can be seen that the resonantfrequency is formed in a low frequency band (800 MHz to 1 GHz) as theelectrical length of the antenna becomes longer.

According to various embodiments, although not illustrated, the leftbezel part may be used as a single-band antenna radiator by selectivelyimplementing the first and second radiation paths. According to anembodiment, the left bezel part may also be used as a multiband antennaradiator by forming a resonant frequency in a desired high frequencyband and a resonant frequency in a desired low frequency band togetherby implementing both the first radiation path and the second radiationpath.

According to the various embodiments, the antenna device is grounded tothe PCB in a desired position of the metal member by using the basicallyprovided electronic component so that it is possible to exclude aseparate electrical connection member, thereby reducing the cost,maximizing the use of space, enhancing the degree of freedom of thedesign of the antenna radiator, and making the electronic device slim.

Various embodiments may provide an antenna device that is implemented tobe grounded in a desired position of a metal member without a separateelectrical connection member, and may provide an electronic device thatincludes the same.

Various embodiments may provide an antenna device that is implementedsuch that the electrical length of an antenna radiator for the operationin a desired frequency band can be easily designed, and may provide anelectronic device that includes the same.

Various embodiments may provide an antenna device that is grounded to aPCB using a basically provided electronic component to maximize the useof space, thereby resulting in the slimness of an electronic device, andmay provide an electronic device that includes the same.

Various embodiments may provide an electronic device that includes: anexternal housing that includes a first surface directed in a firstdirection, a second surface directed in a second direction opposite tothe first direction, and a side surface configured to surround at leasta part of the space between the first and second surfaces; a printedcircuit board (PCB) disposed within the external housing; acommunication circuit disposed on the printed circuit board; at leastone ground member electrically connected with the printed circuit board;an antenna radiator electrically connected with the communicationcircuit and configured to form at least a part of the side surface ofthe external housing; a conductive structure electrically connected withthe at least one ground member and inserted between the printed circuitboard and the antenna radiator; and a non-conductive member configuredto form another part of the side surface of the external housing and toelectrically isolate the antenna radiator while making contact with theantenna radiator, and the antenna radiator may include: a first portionlocated a first distance from the non-conductive member and electricallyconnected with the communication circuit; a second portion located asecond distance, which is larger than the first distance, from thenon-conductive member and electrically connected with the ground member;and a third portion located a third distance, which is larger than thesecond distance, from the non-conductive member and electricallyconnected with the ground member.

According to various embodiments, the communication circuit may beconfigured to transmit a first signal having a first frequency band tothe outside using a portion between the first and second portions of theantenna radiator and to transmit a second signal having a secondfrequency band to the outside using a portion between the first andthird portions of the antenna radiator.

According to various embodiments, the first frequency band may include afrequency higher than the second frequency band.

According to various embodiments, the side surface of the externalhousing may include a first side and a second side; the antenna radiatormay form at least a part of the first side and at least a part of thesecond side; and another antenna radiator disposed to be spaced apartfrom the antenna radiator may form at least one other part of the firstside.

According to various embodiments, the second portion and the thirdportion may be disposed on the second side.

According to various embodiments, the electronic device may furtherinclude another non-conductive member, and the conductive structure maybe insulated from the remaining portions of the antenna radiator otherthan the second and third portions through the other non-conductivemember.

Various embodiments may provide an electronic device that includes: ametal member configured to have a length that contributes to at least apart of the electronic device; a printed circuit board (PCB) configuredto be feed-connected to a preset position of the metal member in orderto apply the metal member as an antenna radiator; and at least oneelectronic component electrically connected to a position different fromthe feeding position of the metal member and grounded to the PCB.

According to various embodiments, for the electronic component, aradiation path that has the ground position that is disposed close tothe feeding position may operate in a higher frequency band than aradiation path that has the ground position that is disposed relativelyfar away from the feeding position.

According to various embodiments, the metal member may be a metal bezelor a decoration member that is disposed such that at least a partthereof is exposed to the outside of the electronic device.

According to various embodiments, the electronic device may furtherinclude a display, and the metal member may be disposed in such a mannerthat the metal member surrounds at least a part of the outer peripheryof the display.

According to various embodiments, the metal member may be formed in aclosed-loop type.

According to various embodiments, the electronic device may be awearable electronic device that is worn on a part of a user's body.

According to various embodiments, the electronic component may includeat least one of a speaker device, a microphone device, various types ofFPCBs, an interface connector port, a camera device, a display, a touchpanel, a vibration motor, or a side key assembly.

According to various embodiments, in a case where the electroniccomponent is a side key assembly, the side key assembly may include: akey button disposed in such a manner that at least a part thereof isexposed, or protrudes, to the outside through a side surface of themetal member; a metal support plate configured to support the key buttonand electrically connected to the metal member; and a flexible printedcircuit board (FPCB) disposed between the key button and the supportplate, the FPCB being electrically connected to the support plate in atleast one position and being grounded to the PCB.

According to various embodiments, the flexible printed circuit board mayhave at least one exposed portion formed therein, through which apattern electrically connected with a ground pad that is grounded to aground part of the PCB is exposed, and the exposed portion may beelectrically connected with the support plate by a physical contacttherebetween.

According to various embodiments, the flexible printed circuit board mayhave a pair of exposed portions formed at opposite ends thereof, throughwhich a pattern electrically connected with a ground pad that isgrounded to a ground part of the PCB is exposed, and at least one of thepair of exposed portions may be electrically connected with the supportplate by a physical contact therebetween.

According to various embodiments, the metal member may operate as amultiband antenna radiator by the electrical lengths between the pair ofexposed portions and the feeding position when the pair of exposedportions is connected with the support plate.

Various embodiments may provide an electronic device that includes: ametal member configured to have a length that contributes to at least apart of the electronic device; a printed circuit board (PCB) configuredto be feed-connected to a preset position of the metal member in orderto apply the metal member as an antenna radiator; and a side keyassembly electrically connected to a position different from the feedingposition of the metal member and grounded to the PCB.

The embodiments of the present disclosure disclosed in the specificationand the drawings are only particular examples proposed in order toeasily describe the technical matters of the present disclosure and helpwith comprehension of the present disclosure, and do not limit the scopeof the present disclosure. Although the present disclosure has beendescribed with an exemplary embodiment, various changes andmodifications may be suggested to one skilled in the art. It is intendedthat the present disclosure encompass such changes and modifications asfall within the scope of the appended claims.

What is claimed is:
 1. A portable communication device comprising: aprinted circuit board (PCB) including communication circuitry and atleast one ground portion formed therein; and a housing accommodating thePCB and forming a side surface of the portable communication device, theside surface including a first portion and a second portion separatedfrom each other by a material disposed therebetween, the first portionhaving a first length and being substantially straight and the secondportion having a second length longer than the first length and formedto include at least one corner of the housing; wherein the first portionis electrically coupled to the communication circuitry via a first feedconnection and adapted to function as a first radiating element; whereinthe second portion is electrically coupled to the communicationcircuitry via a second feed connection different from the first feedconnection and adapted to function as a second radiating element; andwherein the second portion is electrically coupled to the at least oneground portion via at least two ground connections.
 2. The portablecommunication device of claim 1, wherein the material is a dielectricmaterial.
 3. The portable communication device of claim 2, wherein thefirst feed connection includes a first c-clip and the second feedconnection includes a second c-clip.
 4. The portable communicationdevice of claim 3, wherein the second portion is configured to radiatesignals having different frequencies from each other through the atleast two ground connections.
 5. The portable communication device ofclaim 3, wherein the communication circuitry is configured to: transmita first signal corresponding to a first frequency band via the secondportion; and transmit a second signal corresponding to a secondfrequency band via the second portion, the second frequency banddifferent from the first frequency band.
 6. The portable communicationdevice of claim 1, wherein: the at least two ground connections includea first ground connection and a second ground connection, the firstground connection is electrically coupled to a first point of the secondportion, and the second ground connection is electrically coupled to asecond point of the second portion, the second point different from thefirst point.
 7. The portable communication device of claim 6, wherein: afirst area of the second portion between the second feed connection andthe first ground connection is configured to radiate a first signalcorresponding to a first frequency band, and a second area of the secondportion between the second feeding connection and the second groundconnection is configured to radiate a second signal corresponding to asecond frequency band different from the first frequency band.
 8. Theportable communication device of claim 7, wherein the first frequencyband is higher than the second frequency band.
 9. The portablecommunication device of claim 6, wherein: the second feed connection iselectrically coupled to a third point of the second portion, and thethird point is closer to the material than the first point.
 10. Theportable communication device of claim 9, wherein the first point iscloser to the material than the second point.
 11. The portablecommunication device of claim 1, wherein the at least one corner isrounded.
 12. The portable communication device of claim 1, wherein: theat least two ground connections include a first ground connection and asecond ground connection, and the first ground connection includes athird c-clip and the second ground connection includes a fourth c-clip.13. The portable communication device of claim 1, further comprising:another dielectric material disposed at an end of the first portionopposite to another end of the first portion on which the material isdisposed.
 14. The portable communication device of claim 1, wherein thefirst portion is substantially perpendicular to at least part of thesecond portion.
 15. A portable communication device comprising: aprinted circuit board (PCB) including communication circuitry and atleast one ground portion formed therein; and a housing accommodating thePCB and including a side member forming at least portion of a sidesurface of the portable communication device, the side member includinga first portion and a second portion separated from each other by amaterial disposed therebetween, the first portion having a first lengthand being substantially straight and the second portion having a secondlength longer than the first length and formed to include at least onecorner of the housing; wherein the first portion is electrically coupledto the communication circuitry via a first feed connection and adaptedto function as a first radiating element; wherein the second portion iselectrically coupled to the communication circuitry via a second feedconnection different from the first feed connection and adapted tofunction as a second radiating element; and wherein the second portionis electrically coupled to the at least one ground portion via at leasttwo ground connections.
 16. The portable communication device of claim15, wherein the material is a dielectric material.
 17. The portablecommunication device of claim 16, wherein the first feed connectionincludes a first c-clip and the second feed connection includes a secondc-clip.
 18. The portable communication device of claim 17, wherein thesecond portion is configured to radiate signals having differentfrequencies from each other through the at least two ground connections.19. The portable communication device of claim 15, wherein thecommunication circuitry is configured to: transmit a first signalcorresponding to a first frequency band via the second portion; andtransmit a second signal corresponding to a second frequency band viathe second portion, the second frequency band different from the firstfrequency band.
 20. The portable communication device of claim 15,wherein: the at least two ground connections include a first groundconnection and a second ground connection, the first ground connectionis electrically coupled to a first point of the second portion, thesecond ground connection is electrically coupled to a second point ofthe second portion, the second point different from the first point, afirst area of the second portion between the second feed connection andthe first ground connection is configured to radiate a first signalcorresponding to a first frequency band, and a second area of the secondportion between the second feeding connection and the second groundconnection is configured to radiate a second signal corresponding to asecond frequency band different from the first frequency band.